... Apr 11 2021 … Prior to joining Maxtor, Steven worked in various engineering positions at Conner Peripherals in the UK and in Houston. He worked in Deloitte New York Office from 2003 to 2005. Sébastien joined STMicroelectronics in 2000 and has held various management positions in Corporate Strategy, Strategic Partnerships, Sales and Marketing, and Business Development. Engineering Director / 工程总监 JCET / 星科金朋半导体（江阴） 有限公司. The first wave did not last and resulted in AI winter. Prior to joining Quantenna, Mr. Jahangir served as head of Operations and Quality at Synerchip / MultiMedia Crossing (IP later acquired by Silicon Image Inc.) where he oversaw high-speed, mixed-signal IC and system products from concept to end-of-life. Dr. Daping Yao joined NCAP China as a technical director in June 2017. Since 2009, he has been responsible for the company’s packaging assembly process, packaging materials, enabling assembly and test technology development. Julio spends his personal time with his children and volunteering in youth enrichment programs such as Assistant Scout Master for Boy Scouts of America, and coaching youth ice hockey. Mr. Yc Lee was born in Penang, Malaysia. Then moved to MRC, a USA based company for PVD and Etch equipment and later he became responsible for the Unaxis (Oerlikon) Materials and Display Divisions. She is an advisor for the Women in Engineering initiative sponsored by major universities in Silicon Valley and has led Deloitte’s Chinese Service Group, Women’s Initiative (WIN), Client Leader Development program and is nationally recognized as a firm expert for the semiconductor industry. According to the China Semiconductor Industry Association, sales of integrated circuits in China increased 17 percent in 2020, reaching $135 billion. Sébastien has established partnerships with local companies to support the Chinese semiconductor industry and has developed new businesses for ST. He is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out package technologies, including High-Density Fan-Out and SWIFT® technology. With almost 29 years in the semiconductor industry, Michael Wu joined OmniVision in January 2018 and has worked at Motorola, Freescale, Xilinx, Tilera, Lantiq, and most recently at Marvell Semiconductor as VP Sales and Country Manager (China). China International Semiconductor Executive Summit October 12-13, 2021. 近来晶圆级封装 （WLP） 技术通过扇入、扇出和3维堆叠封装发展迅速。我们先比较基于可靠性的首选扇入式晶圆级封装结构，扇出型晶圆级封装（FOWLP）技术自从被智能手机应用以来，已引起业界的极大关注。FOWLP 支持晶圆级系统集成（SiP），包括多个异质芯片集成到重建的晶圆中，以形成专用的封装模块。这种方法能很好地平衡制造成本、模块性能、以及最小的封装体积。3D集成技术是满足 AI 和 HPC 等应用所需性能的主要解决方案。, 华进和中科智芯已经启动很多WLP项目，研究包装设计结构、可靠性、材料验证和工艺流程。我们也将介绍我们最近在各种应用上的一些工作，例如单芯片封装和多芯片集成。, SVP TD SiEn Integrated Circuit Cor / 芯恩青岛集成电路. In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. 3D integration technology is the main solution that can meet the required performance of applications like AI and HPC. Partner，Semiconductor Industry Leader of Deloitte China / 合伙人，德勤中国半导体行业领导人 Deloitte / 德勤华永会计师事务所, Mr. Chen has more than 20 years of professional experience and has been a partner at Deloitte since 2012. They are designed to offer low RdsON and an unprecedented ease of use and efficiency performance, fully exploiting GaN device capability. He has a many years’ experience in both software engineering and software quality. He has served many major multi-national corporate clients such as Toyota and Hitachi for project implementation and was responsible for Business development and production management for Toyota Group at Japan headquarter, He has served as expert for the Japanese Ministry of Foreign Affairs (JICA) and also, as member of the Information System Committee of the Japanese Electrical Society. 电力ICs和器件也正从Si进步到SiC和GaN的技术；正在产品设计和制造上广泛地使用AI和大数据技术 (如:多层次并行优化, 并行设计, 失效分析, 3D封装, 等) 和生产制造 (e.g. Microelectronic Packaging goes Heterogeneous Integration. He was most recently senior vice president of Quality for Western Digital Corporation, who oversaw the quality assurance and customer technical support functions worldwide for all of its brands. If your attendance is withdrawn by us you will receive a full refund of your registration fee. To move up global value chains, it should focus on other areas such as artificial intelligence chips — a new technological field with fewer established incumbents. NCAP-China and CASMEIT have started numerous WLP projects to study packaging design structure, reliability, materials verification, and process flows. Software excellence will become a key-enabler to master highest complexity. Farhat played a pivotal role in making Quantenna successful through manufacturing structure optimization, cost reductions, quality & margins improvement thus enabling Quantenna’s successful IPO in October 2016. Escalating tensions between the US and China are having a marked influence on CEO confidence and the industry outlook. And develop the RF , MEMS and memory etc. Such a method balanced well the manufacturing cost and module performance with the smallest packages. As VP Factory Integration he is currently responsible for the factory control systems in Waferfab, Assembly and Test facilities globally, 1997 – 1998 ​Task force leader production ramp-up, 1998 – 1999 ​Project leader optical SMD devices, 1999 – 2000 ​Marketing Manager Automotive LED, 2001 – 2004 ​Director Development Fiber Optics, 2006 – 2007 ​Director Product Line Manager (R&D+Marketing) at Infineon, Since 2008​ General Manager Industrial Fiber Optics at Avago Technologies, Since 2009 ​Managing Director “Avago Technologies Fiber GmbH”, Since 2011​ Member of the supervisory board at MIC AG, Since 2012​ Managing Director “Avago Technologies Fiber Austria GmbH”, Since 2014 ​Vice President & General Manager – Avago, Represent Continental China in all relevant technical aspects both internally and externally, Lead corporate pilot innovation projects and oversee startup programs, Responsible for cross divisional system development e.g. Earlier he was in charge as IC Design Engineer at STMicroelectronics for Smart Power IC product line. He has presented and given talks at numerous conferences and technical symposiums related to advancedmicroelectronics packaging. Steve also led the Microelectronics Division of CAS Zhangjiang Research Center in Shanghai. Donghui received Bachelor’s degree from Tsinghua University in Beijing in 1994, and PhD from The Ohio State University in Columbus, Ohio in 2000, both in Materials Science and Engineering. For many years he was VP of Sales with Semitool Inc, where he excelled with his in depth knowledge of process and hardware. Moved to MRC (Sputter and Etch). By some measures, Kirin is as competitive as chips made by commercial rivals Qualcomm and Samsung. He brings over 20 years of success in global manufacturing operations, product engineering, quality and reliability functions of semiconductor and system products. This approach of heterogeneous System in Package (SIP) faces two critical issues: the management of components from different sources and the cost of individual operations necessary to complete the package. and M.S. He has over 25 years of experience in the semiconductor industry where he held different positions in development, marketing and management in the fields of Audio and Video, analog and digital TV reception, 4G and 5G communication and WiFi. The evolution of the E/E vehicle architecture towards a centralized, zonal E/E setup is described. In this role, he oversaw an organization of 120 employees and provided consulting services to the IT industry. degree in Materials Science from University of Rochester, NY, United States. Heterogeneous Integration refers to the integration of separately manufactured components and devices into a higher packaging level. In order to build up a high-volume production facility dedicated to FOWLP, he founded Jiangsu CAS Microelectronics Integration Technology Co Ltd (CASMEIT) in March 2018 located in Xuzhou city, Jiangsu province. He has written 10 papers on reliability physics and has received 5 Intel Achievement Awards. She received her master degree in Engineering Management & Industrial Engineering from Stanford University and an M.B.A. from Harvard Business School. He holds more than 60 published patents and (co)-authored over 100 publications in scientific journals/proceedings. M. Juergen Wolf is a member of IEEE and SMTA and among others, a longstanding member and European representative in different technical international packaging groups e.g. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Wilmer has a Bachelor of engineering degree in mechatronic engineering from the University of Electronic Science & Technology of China. Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all around wet processing for wafer and panel level. Wallace joined CNW in 2016 with more than 20 years of experience in international logistics which he gained after completing a Master’s degree in International Transportation Management. Spectral sensing enabled Digital Lateral Flow Test- Fast, Objective, Easy to use, Cloud based. With over 18 years of relevant experience and over 13 years at Goldman Sachs, Mr. Stokes has extensive experience advising companies across the technology industry. Wolf is one of the initiators and co-chair of the Fraunhofer Cluster 3D Integration which was established in 2013 and comprises 5 Fraunhofer institutes. Prior to joining ON Semi/Quantenna Communications, he headed semiconductor manufacturing operations and quality functions at Synerchip Corporation (acquired by Silicon Image) & SiTime (a MEMS based timing solution company). Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team. CMOS sensor as the advanced sensing tip, is around us and improving our daily life anywhere and anytime. The entire world got disrupted early this year with the Covid-19 virus spreading all over the place. Our webinars provide opportunities for political, business, financial, research and industry decision makers to uncover deep, expert insights into the semiconductor industries remotely, without any need to travel. He was the founder, President & CEO and Chairman of the Board of Datang Microelectronics Technology Co., Ltd. from 1996 to 2005. Some of these are purposely set up to benefit from government incentives. Instant data generation requires ultra-low-power devices with an ìalways-onî feature at the same time with high-performance devices that can generate the data instantly. As part of the HPE Pointnext Services team, Gaurav works with customers in their ArtificiaI Intelligence and Machine Learning transformation projects from infrastructure to application level. Be responsible for all 8” GaN-on-Si process development and maintenance in Innoscience. We also collect certain personal data from other group companies to whom you have given information through their websites. China–US strategic competition under Biden, March 21: An ASEAN way to resolve the Myanmar crisis, Global digital governance can start in Asia, The future of digital currencies will be determined in Asia, Central Institute for Economic Management, Centre for Strategic and International Studies, Fiscal Plicy Research Institute Foundation, Institute of World Economics and Politics, Korea Institute for International Economic Policy, New Zealand Institute of Economic Research, Philippines Institute for Development Studies, Singapore Centre for Applied and Policy Economics, Bangladesh Institute of Development Studies, Indian Council for Research on International Economic Relations, Indira Gandhi Institute of Development Research, Institute for Integrated Development Studies, Marga Institute: Centre for Development Studies, National Centre of Applied Economic Research, National Institute of Public Finance and Policy, Pakistan Institute of Development Economics, Research and Information System for Developing Countries. The industry’s first monolithic GaN Power IC has all the features necessary for the next generation of high density and high efficiency AC-DC chargers and adapters. TRUMPF´s innovative process power solutions help tool makers and chip makers to overcome daily challenges like wafer to wafer uniformity, controllability of critical dimensions as well as reducing operational cost over the lifetime. Prior to joining Renesas, Maoka led Post Merger Integration at Lenovo which acquired NECs personal computer business through Joint Venture structure. From May 2019, he has been the Chairman of Zing Semiconductor. China’s chip manufacturing capability is at least two generations (7–10 years) behind the industry leader. Marco serves as Vice President Engineering / IC Design for Navitas Semiconductor and has over 20 years’ experience in the field of Power IC product and technology development in Si and GaN since he received is MSEE in 1996. Mr. Stokes is focused on advising clients across the technology sector. Jan Vardaman - President & Founder, Techsearch International Inc. Tom Stokes - Senior Managing Director, Evercore, Steve Chu - CEO and Executive Vice President, Unisoc Group, Olaf Herzog - VP Corporate Supply Chain & Factory Integration, Infineon, Martin Weigert - Vice President & General Manager, Broadcom Limited, YC Lee - COO, Nantong Tongfu Microelectronics, Xin Wu - Vice President of Silicon Technology, Xilinx, Ke Xu - Director of Engineering / AI Chief Scientist, Microelectronics, Santosh Kumar - Director & Principal Analyst, Packaging, Assembly, Substrates & Semiconductor Manufacturing, YOLE, Tomomitsu Maoka - SVP & Deputy GM Production and Technology Unit, Renesas Electronics Corporation, Marvin Liao - VP, Advanced Packaging Technology and Service, TSMC, Curtis Zwenger - VP 
Adv. 于大全，博士，厦门大学特聘教授、微电子与集成电路系主任，厦门云天半导体创始人。2014-2019年任天水华天科技公司封装技术研究院院长。2010-2015年担任中科院微电子所研究员。2004-2010年先后在香港城市大学、德国Fraunhofer IZM、新加坡微电子所等知名研究机构开展研究。长期从事先进微电子封装技术研究与产业化，发表学术论文200余篇，授权国家发明专利70多项。主要社会任职有：国家科技重大专项02专项总体组特聘专家，中国半导体行业协会MEMS分会副理事长，IEEE高级会员。, Progress of through glass via technology for 3D Wafer Level Packaging. in Finance and Accounting from San Jose State University, Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients, Strong reputation as an advisor and industry expert on Wall Street, IDC executive analyst for Intel and Qualcomm, Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industy conferences including ISS, GSA, CASPA, and SEMI. Since 2018 Donghui started and co-led Dalian technology development teams, and successfully delivered Intel’s first independently developed 144-tier 3D NAND technology in 2020. Dr James Ong is Managing Director and Co-Founder of Artificial Intelligence International Institute (AIII), a think tank focusing on Sustainable AI. Beside the hardware, TRUMPF is also offering engineering expertise for modelling and layout of thermal heating applications used e.g. Since 2011, he is head of the department “Wafer Level System Integration” and also continued managing the center ASSID featuring a 200/300 mm 3D wafer level integration line. Prior to his roles in China, Dr. Yao had been working for Applied Materials Inc., California, USA for more than 20 years in various roles, including development of semiconductor manufacturing processes and equipment. Simon obtained a Bachelor’s Degree from Shanghai University of Science & Technology; a Master’s Degree and a Doctoral Degree from Rensselaer Polytechnic Institute. He started with Intel in 1987, was given the opportunity to start-up the 1st Intel CPU assembly and test factory in Shanghai, China in 2002; followed by the 2nd CPU factory in Chengdu 2 years later. CHENG TING-FANG, Nikkei staff writer January 12, 2021 11:38 JST | China. China Semiconductor Market Vs China Production Trends IC Insights will release its new 2021 McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry later this month. The information contained on this website does not constitute an offer for products or services. Explainable AI (XAI) will thus become a critical component to close the loop to allow human to understand how machines make decisions. While mergers and acquisitions activity moderated as a result of COVID-19, activity has picked up pace in recent months. Build up advanced technology competency across the company: AI, Cyber Security, Robotics etc.
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